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「Message from the president」 was added.
「Designing procedure」 renewed.
1 new machine updated to Products.
・｢Sake Tasting Equipment (Type JSS-01)｣ have been added.
5 new machines updated to Products.
・｢SiC Wafer Thickness Measuring Equipment (Type TME-05)｣
・｢MEMS Wafer Thickness・Si Stepped Measuring Equipment (Type TME-06)｣
・｢Wafer Thickness Measuring Equipment (Type TME-07)｣
・｢Wafer Inspection Instrument (Type MWL-01)｣
・｢Chip Transfer Machine (Type CRM-01)｣ have been added.