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Corporate History

~To date from the establishment of JUSTEM~

1998
Yoshiharu shinbo started a personal business under the name of JTECH.
Designed and manufactured of auto parts processing equipment,
steel pipe production line, etc.
Ran cousulting services of ISO standard.
2003
June to August New staffs have been employed by this company.
They continue to expand its duties, and makes Lapping self-loading equipment.
September Moved to LABONA in Techno plaza, NICO.
Manufactured electric components in parallel with development of equipment.
Developed "Non-contact wafer thickness measuring equipment",
"thread rolling machine".
2004
Development / Delivery record
Wafer thickness measuring equipment
Wafer transfer equipment
Load/Unload equipment for lapping machine
2005
June JUSTEM CO., LTD has established.
President : Yoshiharu shinbo
Paid-in capital : 10 million yen
Number of employees : 7
Development / Delivery record
Precision thread rolling machine
Carrier thickness measuring equipment
Deburring machine
Opening polishing machine
Fluorescent lighting equipment
Wafer thickness sorting equipment
2006
October The capital has been increased to 19 million yen.
Development / Delivery record
Carrier thickness measuring equipment
Lapping cleaning thickness measuring equipment
Powder processing equipment
Wafer thickness measuring equipment
Wafer handling equipment
Manual wafer thickness measuring equipment
Flourescent lighting equipment
Quartz glass surface inspection equipment
Spiral grinding machine
Chamfered notch loader
2007
February In collaboration with the Industrial Technology Research Institute of Niigata Prefectural,
Developed "a large-diameter silicon wafers measuring instruments (type FTM)".
Development / Delivery record
Device embedded thickness measuring equipment
Wafer transfer equipment
Wafer thickness equipment
Wafer cleaning equipment
Lamp heating equipment
Laser type manual carrier thickness measuring equipment
Wafer edge inspection handling equipment
Spiral grinding machine
Manual Wafer thickness measuring equipment
Wafer loader
Wafer shooter
Manual barcode reader
Chamfered notch loader
2008
January In phase 3('08/Jan), achieved sales of 400 million yen.
April Opened the Tokyo office at Machida,Tokyo.
October Changed the system
Chairman : Yoshiharu Shinbo
President : Yoshinari Shinbo
With the business expansion, moved to the new office building in 1-15 Shin-yoh, Nagaoka-City.
Number of employees : 18
Development / Delivery record
Spin coater
Wafer loader
Wafer shoooter
Wafer wound inspection equipment proto machine
Wafer scratch inspection equipment
Wafer sorting equipment
Manual wafer thickness measuring equipment
Wafer thickness measuring equipment
Spiral grinding machine
Wafer wound inspection equipment
Chamfered notch loader Wafer loader
Carrier thickness measuring equipment
Manual carrier thickness measuring equipment
Container rotating equipment
Chip measuring stage jig
Finish rolling panel
Automated resistivity measuring equipment
Automated wafer cleaner
Piston ring testing machine
2009
April Kuninao Iesaka was appointed as a vice president,
in order to expand a manegement system.
Being approved of the frontier challenge subsidy work in Nagaoka,
developed "φ450mm wafer thickness measuring equipment".
Development / Delivery record
Wafer thickness measuring equipment
Medical inspection equipment
Wafer thickness sorting equipment
2010
April Transferred the Tokyo office in Nihonbashi, Chuo-ku, Tokyo.
Being approved of the frontier challenge subsidy work in Nagaoka,
developed "Variety multilayer wafer thickness measuring equipment by an optical sensor".
Development / Delivery record
Thickness measuring, wound inspection unit
Wafer thickness sorting equipment
Non-contact wafer diameter measuring equipment
Wafer dryer
Manual wafer cleaning equipment
Manual wafer dryer
Automated resistivity measuring equipment
Wafer shooter
Notch processing jig
FPC inspection equipment
Flat digitizer
2011
April The Tokyo office is integrated into the head office.
Development / Delivery record
Wafer shooter
Spin coater
Ceramics substrate sorting equipment
Sapphire wafer thickness sorting equipment
MEMS thickness measuring equipment
Wafer surface inspection equipment
Automated resistivity measuring equipment
Non-contact wafer diameter measuring equipment
Spreading resistance measuring equipment
2012年
June Being approved of the frontier callenge subsidy work in Nagaoka,
developed "shape measuring equipment".
The clean room was completed in the factory of the head office.
Development / Delivery record
Inspection equipment
Chip transfer Machine
Substrate transfer equipment
Wafer surface inspection equipment
Shape measuring equipment
2013年
August Being approved of Manufacturing support subsidy work in the Ministry of Economy, Trade and Industry,
trial developed "defect and particle of wafer such as transparent body automatic inspection equipment".

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